Notice of retraction
Vol. 32, No. 8(2), S&M2292

ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 Sensors and Materials
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pp. 453-462
S&M2467 Research Paper of Special Issue

Total Supply Capability of Power Distribution Network with Different Types of Power Loads

Xiaochun Weng, Shichuan Chen, Dacai Chen, and Xue Chen

(Received July 20, 2020; Accepted December 4, 2020)

Keywords: distribution network, N-1 contingency, demand factor, total supply capability, feeder

Corresponding author: Xiaochun Weng




Forthcoming Regular Issues


Forthcoming Special Issues

Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices Part 2(1)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (4)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Cheng-Hsing Hsu (National United University), Ja-Hao Chen (Feng Chia University), and Wei-Ling Hsu (Huaiyin Normal University)
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Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices Part 2(2)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


Special Issue on New Trends in Robots and Their Applications
Guest editor, Ikuo Yamamoto (Nagasaki University)


Special Issue on Artificial Intelligence in Sensing Technologies and Systems
Guest editor, Prof. Lin Lin (Dalian University of Technology)
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Special issue on Novel Materials and Sensing Technologies on Electronic and Mechanical Devices (3)
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Hsien-Wei Tseng (Longyan University)


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