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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 31, Number 9(2) (2019)
Copyright(C) MYU K.K.
pp. 2861-2872
S&M1977 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2449
Published: September 20, 2019

Counterbalanced Valve Metal Oxide as a Reliable Dielectric Layer for Electrowetting-on-dielectric Devices [PDF]

Supin Chen and Chang-Jin “CJ” Kim

(Received May 29, 2019; Accepted June 24, 2019)

Keywords: valve metal oxide, electrowetting, electrowetting-on-dielectric (EWOD), digital microfluidics

Valve metal oxide (anodized oxide) is used in a mirrored configuration to serve as self-limiting dielectric layers of electrowetting-on-dielectric (EWOD) devices. Resembling nonpolar electrolytic capacitors, the two opposing metal-dielectric layers always counterbalance each other so that voltages of any polarity can be applied without current flow. By using tantalum pentoxide as the valve metal oxide for experimental evaluation, the mirrored configuration is compared with the usual configuration and further compared with silicon oxide and silicon nitride, which are two dielectric materials commonly used for EWOD. Experiments with a range of applied biases confirm that in a mirrored configuration, one of the two metal-dielectric-electrolyte combinations is always reverse-biased to prevent the current leakage, which is the most common mode of failure for the EWOD devices. The utility is demonstrated by manipulating droplets of KCl solution on both the parallel-plate and one-plate EWOD devices.

Corresponding author: Chang-Jin “CJ” Kim


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Cite this article
Supin Chen and Chang-Jin “CJ” Kim, Counterbalanced Valve Metal Oxide as a Reliable Dielectric Layer for Electrowetting-on-dielectric Devices, Sens. Mater., Vol. 31, No. 9, 2019, p. 2861-2872.



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