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Vol. 34, No. 8(3), S&M3042

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Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 31, Number 2(2) (2019)
Copyright(C) MYU K.K.
pp. 501-507
S&M1790 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2160
Published: February 18, 2019

Structural and Electrical Characteristics of Solution-processed Copper Oxide Films for Application in Thin-film Transistors [PDF]

Heonju Lee, Xue Zhang, Eui-Jik Kim, and Jaehoon Park

(Received October 15, 2018; Accepted December 3, 2018)

Keywords: sol-gel process, oxide semiconductor, copper oxide, thermal annealing, thin-film transistor

In this study, we investigated the effect of the annealing time of copper oxide (CuO) on the morphological and chemical characteristics of films and the electrical properties of bottom-gate/top-contact CuO thin-film transistors (TFTs). Thermogravimetric analysis showed that thermal annealing at 600 ℃ for 30 min and 3 h resulted in the formation of CuO films. The CuO films were analyzed by X-ray diffraction, X-ray photoemission spectroscopy, absorbance determination, and Raman spectroscopy. As the annealing time of the CuO film was increased, the composition of the films changed from Cu(OH)2 to CuO. Considering the overall TFT performance, the optimal annealing time in solution-processed CuO semiconductors was determined to be 3 h. These results suggest that the annealing time is crucial in modulating the chemical characteristics of solution-processed CuO thin films and the TFT performance.

Corresponding author: Jaehoon Park


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Cite this article
Heonju Lee, Xue Zhang, Eui-Jik Kim, and Jaehoon Park, Structural and Electrical Characteristics of Solution-processed Copper Oxide Films for Application in Thin-film Transistors, Sens. Mater., Vol. 31, No. 2, 2019, p. 501-507.



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