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Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 31, Number 3(1) (2019)
Copyright(C) MYU K.K.
pp. 743-749
S&M1810 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2119
Published: March 8, 2019

Annealing Cycle Dependence of Thermal Conductivity for Si-Ge-Au Thin Film Analyzed by Thermal Microscopy [PDF]

Tsuyoshi Nishi, Tomohiro Mayama, Hiromichi Ohta, and Yoichi Okamoto

(Received August 24, 2018; Accepted November 9, 2018)

Keywords: thermal effusivity, Si–Ge–Au, amorphous, thin film, thermal microscope, thermal conductivity

The thermal effusivity of a Si–Ge–Au thin film was measured using a thermal microscope. A thin-film sample with sixty-seven artificial intervals each comprising Si (2.0 nm)/Au-doped Ge (2.5 nm) was prepared and annealed more than 20 times. The dependence of the thermal conductivity of the film on the number of annealing cycles was determined using the obtained experimental thermal effusivity data, bulk density, and specific heat capacity. The film thickness (~300 nm) was greater than the thermal diffusion length of the samples. The thermal conductivity of the Si–Ge–Au thin film was satisfactory considering the number of annealing cycles. Thus, we elucidated the annealing effect of thermal conductivity for the Si–Ge–Au thin film.

Corresponding author: Tsuyoshi Nishi, Tomohiro Mayama


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Cite this article
Tsuyoshi Nishi, Tomohiro Mayama, Hiromichi Ohta, and Yoichi Okamoto, Annealing Cycle Dependence of Thermal Conductivity for Si-Ge-Au Thin Film Analyzed by Thermal Microscopy, Sens. Mater., Vol. 31, No. 3, 2019, p. 743-749.



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