Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 28, Number 5 (2016)
Copyright(C) MYU K.K.
pp. 493-501
S&M1202 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2016.1305
Published: May 25, 2016

Design and Fabrication of Identification Inkjet Print Head Chip Fuse Sensors [PDF]

Jian-Chiun Liou, Cheng-Fu Yang, and Cihun-Siyong Gong

(Received August 31, 2015; Accepted March 9, 2016)

Keywords: identification, CMOS-MEMS, multiplexer, addressing, X-ray

This paper describes the development of a thermal inkjet print head with an identification circuit. The identification circuit was designed using a fuse and other electronic components. The multifunctionality of the integrated circuit in a print head of the cartridge was used to satisfy user demands. The circuit was encoded to enable identification of general information regarding the ink cartridge, such as its model number, serial number, color settings (color or gray scale), and the best print quality. In addition, the current status of the cartridge, such as whether its life has elapsed, can be identified. The identification circuit was connected in series with the metal oxide semiconductor (MOS) drain fuse after the wafer factory burn break fuse. A VID of more than 3.6 V indicates a blown fuse. Therefore, the fuse-blow voltage was set to be 3.6 V. At a value of VGS equal to 15.5 V, blown fuse parameter analysis was performed. Linear regression showed that the ID current was 54.36 mA. X-ray diffraction patterns revealed that the X-rays penetrate the fuse circuit from the top. Therefore, the elemental composition of all layers, from the upper layer SiC/SiN to the Si substrate, was analyzed and determined to be Si, C, N, Ta, Al, P, and O, among others. Because most layers contain Si, the Si peak was the largest. The fuse profile was characterized using scanning electron microscopy. Fuse size and current density were also investigated.

Corresponding author: Cheng-Fu Yang


Cite this article
Jian-Chiun Liou, Cheng-Fu Yang, and Cihun-Siyong Gong, Design and Fabrication of Identification Inkjet Print Head Chip Fuse Sensors, Sens. Mater., Vol. 28, No. 5, 2016, p. 493-501.



Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.