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Sensors and Materials
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Sensors and Materials, Volume 27, Number 11 (2015)
Copyright(C) MYU K.K.
pp. 1091-1101
S&M1146 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2015.1210
Published: December 9, 2015

Design and Microfabrication of Cooling Arm for Inertial Confinement Fusion Application [PDF]

Bin Xu, Jing-quan Liu, Shui-dong Jiang, Gang Tang, Xiao-xiao Yan, Bin Yang, Xiang Chen and Chun-sheng Yang

(Received May 21, 2015; Accepted August 20, 2015)

Keywords: cooling arm, inertial confinement fusion, MEMS, temperature simulation, optimization design

Inertial confinement fusion (ICF) mainly uses strong focus laser beams to irradiate the target to obtain sufficient energy. The ignition target is an essential factor for inducing a fusion reaction within a capsule. The cooling arm that connects the cooling source to the hohlraum is an important part of the ignition target, which is used to obtain an accurate and uniform temperature field for the deuterium-tritium ice pellet. To improve the temperature uniformity of the connecting surfaces between the cooling arm and the hohlraum, the cooling arm is designed to have a groove structure. On the basis of theoretical analysis and temperature simulation, the three-branch cooling arm was found to have a smaller temperature difference on the clamping surface and better mechanical strength than the cooling arm with fewer branches. Moreover, the fracture failure test shows that the fracture force of the three-branch cooling arm is 1.12 N, which is larger than that of the two-branch cooling arm. Because the smoothness of the connecting surface between the cooling arm and the hohlraum has a considerable effect on heat transfer, a KOH:isopropanol (IPA) solution is used to polish the rough deep reactive ion etching (DRIE) surface.

Corresponding author: Jing-quan Liu


Cite this article
Bin Xu, Jing-quan Liu, Shui-dong Jiang, Gang Tang, Xiao-xiao Yan, Bin Yang, Xiang Chen and Chun-sheng Yang, Design and Microfabrication of Cooling Arm for Inertial Confinement Fusion Application, Sens. Mater., Vol. 27, No. 11, 2015, p. 1091-1101.



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