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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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English 日本語
Instructions for manuscript preparation
English 日本語
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MYU K.K.
Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 17, Number 5 (2005)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 227-236
S&M601 Research Paper of Special Issue Published: 2005 A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure [PDF] Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun (Received August 21, 2004; Accepted December 6, 2004) Keywords: wafer level packaging (WLP), solder, hermeticity, interconnection, lateral bonding
A wafer level lateral bonding scheme is presented as an alternative to MEMS packag- ing applications. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the new scheme. The most distinct difference between this new scheme and conventional ones is that wafers are laterally bonded by solder reflow with a new apparatus. This lateral bonding scheme has merits in that it is morphologically insensitive and enables not only hermetic sealing but also electrical via-interconnection. Bonding strength is evaluated under shear and the hermeticity of encapsulation is examined using the pressurized helium leak detection method based on MIL-STD 883E. Results show that the new scheme is feasible as an alternative method for high-yield wafer level packaging.
Corresponding author: Eunsung Lee Cite this article Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun, A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure, Sens. Mater., Vol. 17, No. 5, 2005, p. 227-236. |
Forthcoming Regular Issues
Forthcoming Special Issues
Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
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Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
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Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
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Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
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Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2023)
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For more information of Special Issues (click here)
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Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2024)
- Accepted papers (click here)
- A Prototype Portable Voltammetric Sensor for Determining Titratable Acidity of Sake and Moromi
Akira Kotani, Kokoro Taniguchi, Koichi Machida, Kazuhiro Yamamoto, and Hideki Hakamata - PACKTEST for L-Glutamate Quantification: Development of On-site and High-throughput Analytical Kits using L-Glutamate Oxidase Mutant
Keita Murai, Hiroki Yamaguchi, Satoru Furuuchi, Kazutoshi Takahashi, Uno Tagami, Moemi Tatsumi, Toshimi Mizukoshi, Hiroshi Miyano, Shuntaro Okauchi, and Masayuki Sugiki - Development of Portable Multi-fluorescence Detection System Using Indium Tin Oxide Heater for Loop-mediated Isothermal Amplification
Ryo Ishii, Sota Hirose, Shoji Yamamoto, Kazuhiro Morioka, Akihide Hemmi, and Hizuru Nakajima - Reproduction of Absorption Spectra of Bromothymol Blue–Methyl Red Mixed Indicator from RGB and L*a*b* Color Coordinates and Application to Fast Spectrum Acquisition
Yusuke Kimura, Arinori Inagawa, and Nobuo Uehara - Orthogonality of α-Sulfoquinovosidase in Human Cells and Development of Its Fluorescent Substrate
Ryosuke Yoshida, Ryosei Kaguma, Ryosuke Kaneko, Ichiro Matuso, Makoto Yoritate, Go Hirai, Takamasa Teramoto, Yoshimitsu Kakuta, Kosuke Minamihata, Noriho Kamiya, Teruki Nii, Akihiro Kishimura, Takeshi Mori, and Yoshiki Katayama
- A Prototype Portable Voltammetric Sensor for Determining Titratable Acidity of Sake and Moromi
- Accepted papers (click here)
- Healthcare System from Multisensor Collaboration and Human Action Recognition
Hongwei Gao, Xuna Wang, Zide Liu, and Yueqiu Jiang
- Healthcare System from Multisensor Collaboration and Human Action Recognition
Guest editor, Sheng-Joue Young (National United University)
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Special Issue on Asia-Pacific Conference of Transducers and Micro-Nano Technology 2024 (APCOT 2024)
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Special Issue on Sensing and Information and Communication Technologies toward Non-intrusive, Undisturbed, and Calm Healthcare Monitoring
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Special Issue on Innovative Approaches to Forest Monitoring Using Sensing Techniques
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Special Issue on Sensor for Society
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Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2023)
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Special Issue on Materials, Devices, Circuits, and Analytical Methods for Various Sensors (Selected Papers from ICSEVEN 2024)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Mu-Chun Wang (Minghsin University of Science and Technology), Shih-Hung Lin (Chung Shan Medical University), Ja-Hao Chen (Feng Chia University)
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Special Issue on Sensing and Data Analysis Technologies for Living Environment, Health Care, Production Management, and Engineering/Science Education Applications (2023)
Guest editor, Chien-Jung Huang (National University of Kaohsiung), Rey-Chue Hwang (I-Shou University), Ja-Hao Chen (Feng Chia University), Ba-Son Nguyen (Lac Hong University)
Special Issue on Sensing and Data Analysis Technologies for Living Environment, Health Care, Production Management, and Engineering/Science Education Applications (2024)
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Special Issue on 2D Materials-based Sensors and MEMS/NEMS
Guest editor, Kazuhiro Takahashi (Toyohashi University of Technology)
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Special Issue on Biosensing Technology Using Micro- and Nanostructures
Guest editor, Kazuhiro Morioka and Atsushi Shoji (Tokyo University of Pharmacy and Life Sciences)
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Special Issue on Advanced Sensors Materials and Processes
Guest editor, Shih-Chen Shi (National Cheng Kung University) and Tao-Hsing Chen (National Kaohsiung University of Science and Technology)
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Special Issue on Advanced Sensing Technologies for Green Energy
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Special Issue on Spatial Information and Digital Twins for Built Environment Development
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Special Issue on Mobile Computing and Ubiquitous Networking for IoT Society
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Special Issue on Intelligent Sensing and Analysis for Human–Machine Interaction in Healthcare, Biomedical Engineering, and Human-Centered Industrie
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Special Issue on Multisource Sensors for Geographic Spatiotemporal Analysis and Social Sensing Technology
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Special Issue on Geomatics Technologies for the Realization of Smart Cities
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Special Issue on New Functions of Micro/Nanomaterials and Devices
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Special Issue on Smart Sensing Approaches for Low Carbon, Energy-efficient Manufacturing Processes
Guest editor, Cheng-Chi Wang (National Sun Yat-sen University)
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Special Issue on Smart Sensors for Chemical and Agriculture Applications
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- Accepted papers (click here)
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