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Vol. 32, No. 8(2), S&M2292

ISSN (print) 0914-4935
ISSN (online) 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 17, Number 4 (2005)
Copyright(C) MYU K.K.
pp. 219-226
S&M600 Research Paper
Published: 2005

Polyvinyl Alcohol-co-Styrene Sulfonate/FeCl2 Composite as Humidity Sensing Material [PDF]

Il-Jin Kim, Sang-Do Han, Ishwar Singh, Hi-Deok Lee and Jin Suk Wang

(Received December 24, 2004; Accepted April 15, 2005)

Keywords: humidity sensor, polyvinylalcohol-co-styrene sulfonate/ ferrous chloride composite

Polyvinyl alcohol shows a significant impedance response with changing relative humidity (RH) only above 60% RH. Simply fabricated polyvinyl alcohol film as a humidity sensor lacks durability and also shows high impedance. To overcome this problem, polyvinyl alcohol was crosslinked with 4-styrene sulfonate (sodium salt) in the presence of ferrous ions. The best results with the material as a humidity sensor were obtained when polyvinyl alcohol was crosslinked with 4-styrene sulfonate in the presence of ferrous ions at a temperature of 140C for about 1 h and when polyvinyl alcohol, 4- styrene sulfonate (sodium salt hydrate) and FeCl2·4H2O were used in a weight ratio of 10:2:3, respectively. The polymeric mixture of the three materials in water was cast on an alumina substrate (7.5 mm  7.2 mm  0.38 mm in size) prefabricated with interdigitized gold electrodes and was cured at a temperature of 140C for 1 h. The results demonstrate that the logarithm of the impedance decreased linearly with increasing %RH in the range from 30 to 92% RH. Other factors, such as stability, sensitivity and response time for the fabricated sensor, were also determined.

Corresponding author: Sang-Do Han


Cite this article
Il-Jin Kim, Sang-Do Han, Ishwar Singh, Hi-Deok Lee and Jin Suk Wang, Polyvinyl Alcohol-co-Styrene Sulfonate/FeCl2 Composite as Humidity Sensing Material, Sens. Mater., Vol. 17, No. 4, 2005, p. 219-226.



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